NXP BSP230,135
NXP BSP230,135

NXP BSP230,135

Manufacturer No:

BSP230,135

Manufacturer:

NXP

Package:

TO-261-4, TO-261AA

Description:

MOSFET P-Channel, Metal Oxide Digi-Reel? 17 Ohm @ 170mA, 10V 300V TO-261-4, TO-261AA

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

Price not displayed? Please send an RFQ, and we will respond immediately.

BSP230,135 information

NXP BSP230,135 technical specifications, attributes, parameters and parts with similar specifications to NXP BSP230,135.

  • Type
  • Parameter
  • Package / Case
  • TO-261-4, TO-261AA
  • Mounting Type
  • Surface Mount
  • Contact Plating
  • Tin
  • Number of Pins
  • 4
  • Supplier Device Package
  • SC-73
  • Weight
  • 4.535924 g
  • RoHS Status
  • RoHS Compliant
  • Input Capacitance (Ciss) @ Vds
  • 90pF @ 25V
  • Online Catalog
  • P-Channel Logic Level Gate FETs
  • PCN Packaging
  • Lighter Reels 02/Jan/2014
  • PCN Design/Specification
  • Resin Hardener 02/Jul/2013
  • Standard Package
  • 1
  • Turn-On Delay Time
  • 5 ns
  • Packaging
  • Digi-Reel?
  • Termination
  • SMD/SMT
  • Resistance
  • 17 Ω
  • Max Operating Temperature
  • 150 °C
  • Min Operating Temperature
  • -65 °C
  • Max Power Dissipation
  • 1.5 W
  • Element Configuration
  • Single
  • Power Dissipation
  • 1.5 W
  • Power - Max
  • 1.5W
  • Family
  • FETs - Single
  • FET Type
  • MOSFET P-Channel, Metal Oxide
  • Vgs(th) (Max) @ Id
  • 2.55V @ 1mA
  • Current - Continuous Drain (Id) @ 25°C
  • 210mA (Ta)
  • Drain to Source Voltage (Vdss)
  • 300V
  • Turn-Off Delay Time
  • 15 ns
  • Continuous Drain Current (ID)
  • 210 mA
  • Threshold Voltage
  • -2.8 V
  • Gate to Source Voltage (Vgs)
  • 20 V
  • Max Dual Supply Voltage
  • -300 V
  • Drain to Source Breakdown Voltage
  • 300 V
  • Dual Supply Voltage
  • -300 V
  • Input Capacitance
  • 90 pF
  • FET Feature
  • Logic Level Gate
  • Drain to Source Resistance
  • 17 Ω
  • Rds On Max
  • 17 Ω
  • Nominal Vgs
  • -2.55 V
  • Length
  • 6.7 mm
  • Height
  • 1.7 mm
  • Width
  • 3.7 mm
  • Radiation Hardening
  • No
  • REACH SVHC
  • No SVHC
  • Lead Free
  • Lead Free

Download datasheets and manufacturer documentation for NXP BSP230,135.

BSP230,135 Overview


The drain current is the maximum continuous current the device can conduct, and the continuous drain current (ID) of this device is 210 mA. Drain-source breakdown voltage is the VDS at which a specified value of ID flows, with VGS=300 V. And this device has 300 V drain to source breakdown voltage.Turn-Off delay time is the time taken to charge the input capacitance of the device before drain current conduction can start, and its turn-off delay time is 15 ns. Drain to Source Resistance is the resistance between the drain and the source of a MOSFET when a specific gate-to-source voltage (VGS) is applied to bias the device to the on state, and the resistance of this device is 17 Ω. The gate-source voltage, VGS, of a FET transistor is the voltage that falls across the gate-source terminal of the transistor and its voltage can be 20 V.Powered by -300 V, it supports the maximal dual supply voltage.Threshold voltage is the point at which an electrical device is set to activate any one of its operations, and this transistor has -2.8 V threshold voltage. Operating this transistor requires a 300V drain to source voltage (Vdss).

BSP230,135 Features


a continuous drain current (ID) of 210 mA
a drain-to-source breakdown voltage of 300 V voltage
the turn-off delay time is 15 ns
single MOSFETs transistor is 17 Ω
a threshold voltage of -2.8 V
a 300V drain to source voltage (Vdss)


BSP230,135 Applications


There are a lot of NXP USA Inc.
BSP230,135 applications of single MOSFETs transistors.


  • LCD/LED TV
  • Consumer Appliances
  • Lighting
  • Uninterruptible Power Supply
  • AC-DC Power Supply
  • Synchronous Rectification for ATX 1 Server I Telecom PSU
  • Motor drives and Uninterruptible Power Supplies
  • Micro Solar Inverter
  • DC/DC converters
  • Power Tools

User Guide

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Step2:Desiccant Protection

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Step4:Individual Package

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Step5:Anti-collision Filling

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