

NXP LPC2364FBD100,551
Manufacturer No:
LPC2364FBD100,551
Manufacturer:
Package:
100-LQFP
Description:
128KB 128K x 8 FLASH ARM7® 16/32-Bit Microcontroller LPC2300 Series LPC2364 3.3V 100-LQFP
Quantity:
Delivery:




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In Stock :Available
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LPC2364FBD100,551 information
NXP LPC2364FBD100,551 technical specifications, attributes, parameters and parts with similar specifications to NXP LPC2364FBD100,551.
- Type
- Parameter
- Factory Lead Time
- 12 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 100-LQFP
- Surface Mount
- YES
- Operating Temperature
- -40°C~85°C TA
- Packaging
- Tray
- Series
- LPC2300
- Published
- 2003
- JESD-609 Code
- e3
- Part Status
- Not For New Designs
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 100
- ECCN Code
- EAR99
- Terminal Finish
- Tin (Sn)
- HTS Code
- 8542.31.00.01
- Subcategory
- Microcontrollers
- Technology
- CMOS
- Terminal Position
- QUAD
- Terminal Form
- GULL WING
- Peak Reflow Temperature (Cel)
- 260
- Supply Voltage
- 3.3V
- Terminal Pitch
- 0.5mm
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- Base Part Number
- LPC2364
- JESD-30 Code
- S-PQFP-G100
- Qualification Status
- Not Qualified
- Supply Voltage-Max (Vsup)
- 3.6V
- Power Supplies
- 3.3V
- Supply Voltage-Min (Vsup)
- 3V
- Oscillator Type
- Internal
- Number of I/O
- 70
- Speed
- 72MHz
- RAM Size
- 34K x 8
- Voltage - Supply (Vcc/Vdd)
- 3V~3.6V
- uPs/uCs/Peripheral ICs Type
- MICROCONTROLLER, RISC
- Core Processor
- ARM7®
- Peripherals
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Clock Frequency
- 25MHz
- Program Memory Type
- FLASH
- Core Size
- 16/32-Bit
- Program Memory Size
- 128KB 128K x 8
- Connectivity
- CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
- Supply Current-Max
- 100mA
- Bit Size
- 32
- Data Converter
- A/D 6x10b; D/A 1x10b
- Has ADC
- YES
- DMA Channels
- YES
Download datasheets and manufacturer documentation for NXP LPC2364FBD100,551.
Datasheets:
Environmental Information:
LPC2364FBD100,551 Overview
To save space, it is included in the 100-LQFP package. The way of mounting it is Surface Mount. In the package Tray, it is included. The device runs in ARM7? core processor. Work should be performed at a temperature of -40°C~85°C TA. There is FLASH program memory in it. There are 70 I/Os on it. To find equivalent components, use its LPC2364 base part number. The position of the device is QUAD at terminal. It has 100 terminationals. The LPC2300 series includes this electrical component. Using the 3.3V supply voltage allows for high efficiency. It has uPs/uCs/Peripheral IC - MICROCONTROLLER, RISC. This device has a total of 100 pins. In the subcategory of Microcontrollers, this component is included. 100mA is the maximum supply current. Powered by a 3.3V source. During the operation of the device, the clock runs at a frequency of 25MHz. During normal operation, the supply voltage (Vsup) should be kept above 3V. Using a Internal oscillator type, it works well.
LPC2364FBD100,551 Features
100-LQFP package
Mounting type of Surface Mount
Microcontrollers subcategory
LPC2364FBD100,551 Applications
There are a lot of NXP USA Inc. LPC2364FBD100,551 Microcontroller applications.
Home video and audio
Fax machines
Computer/laptop
Robots
Light sensing & controlling devices
Mice
Set-top boxes
Entertainment products
Magnetic resonance imaging (MRI)
Oil and gas
User Guide
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1:Prepare product

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step4:Individual Package

Step5:Anti-collision Filling

Step6:Packaging Box
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