
ONSEMI NTTFSSCH4D0N08XLTWG
Manufacturer No:
NTTFSSCH4D0N08XLTWG
Manufacturer:
ONSEMI
Package:
Description:
MOSFET - PowerTrench® T10, Single, N-Channel, Source Down, DualCool 33, WDFN9, 80 V, 3.6 mΩ, 107 A
Quantity:
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In Stock :Available
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NTTFSSCH4D0N08XLTWG information
ONSEMI NTTFSSCH4D0N08XLTWG technical specifications, attributes, parameters and parts with similar specifications to ONSEMI NTTFSSCH4D0N08XLTWG.
- Type
- Parameter
- OPN in older Technology
- 0
- V(BR)DSS Min (V)
- 80
- Silicon Family
- PowerTrench® T10
- Gate Level
- Logic
- MSL Type
- 1
- Container Type
- REEL
- Channel Polarity
- N-Channel
- Qg Typ @ VGS = 4.5 V (nC)
- 19
- Qgd Typ @ VGS = 4.5 V (nC)
- ~NA~
- Package Type
- WDFN9 3.30x3.30x0.58, 0.65P
- Wide SOA Mosfets
- 0
- RDS(on) Max @ VGS = 4.5 V (mΩ)
- 5.3
- Coss Typ (pF)
- 630
- Type
- Low-Medium Voltage
- Vgs(th) Max (V)
- 2.1
- ID Max (A)
- 107
- RDS(on) Max @ VGS = 2.5 V (mΩ)
- ~NA~
- Qg Typ @ VGS = 10 V (nC)
- 40
- Package Name
- Power 33 Dual Cool Source Down
- PD Max (W)
- 102
- Crss Typ (pF)
- 18
- RDS(on) Max @ VGS = 10 V (mΩ)
- 3.6
- Configuration
- Single
- Vgs (V)
- 20
- Ciss Typ (pF)
- 2520
- Qrr Typ (nC)
- 109
- MSL Temp (°C)
- 260
Download datasheets and manufacturer documentation for ONSEMI NTTFSSCH4D0N08XLTWG.
Datasheet:
The latest 80V logic gate level power MOSFET technology with best-in-class Figure-of-Merit for switching application. Lower on-resistance and less output capacitance can reduce the conduction and switching loss to accomplish higher efficiency requirement. smaller peak reverse recovery current with good softness behavior can perform lower voltage spike with better EMI performance.This product is an improved 3x3 source-down Dual cool GEN2 package product, this has better thermal performance than previous 3x3 source down dual cool package with high thermal conductivity mold compound to achieve TC-55°C to +175°C
Application
- High Switching Frequency DC−DC Conversion
- Synchronous Rectifier
End Product
- Cloud system
- Datacenter / IBC
- Power Supply Unit
Feature
- Advanced Source−Down Center Gate Dual−Cooling Package Technology (3.3x3.3mm)
- Ultra Low RDS(on)
- Low QG and Capacitance
User Guide
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
MEANS OF PAYMENTFor your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.
RFQ (REQUEST FOR QUOTATIONS)Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1:Prepare product

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step4:Individual Package

Step5:Anti-collision Filling

Step6:Packaging Box
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
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