AMD XC7Z030-3FFG676E

Manufacturer No:

XC7Z030-3FFG676E

Manufacturer:

AMD

Package:

676-BBGA, FCBGA

Description:

676 Terminations 0°C~100°C TJ 676 Pin XC7Z030 System On Chip Zynq®-7000 Series 130 I/O 1V

Quantity:

Delivery:

Payment:

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XC7Z030-3FFG676E information

AMD XC7Z030-3FFG676E technical specifications, attributes, parameters and parts with similar specifications to AMD XC7Z030-3FFG676E.

Type
Parameter

Factory Lead Time
10 Weeks

Contact Plating
Copper, Silver, Tin

Package / Case
676-BBGA, FCBGA

Surface Mount
YES

Number of Pins
676

Operating Temperature
0°C~100°C TJ

Packaging
Tray

Series
Zynq®-7000

Published
2009

JESD-609 Code
e1

Part Status
Active

Moisture Sensitivity Level (MSL)
4 (72 Hours)

Number of Terminations
676

ECCN Code
3A991.D

Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)

HTS Code
8542.39.00.01

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
245

Supply Voltage
1V

Terminal Pitch
1mm

Frequency
1GHz

Time@Peak Reflow Temperature-Max (s)
30

Operating Supply Voltage
1V

Supply Voltage-Max (Vsup)
1.05V

Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

Number of I/O
130

RAM Size
256KB

Core Processor
Dual ARM® Cortex®-A9 MPCore? with CoreSight?

Peripherals
DMA

Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture
MCU, FPGA

Data Bus Width
32b

Core Architecture
ARM

Boundary Scan
YES

Speed Grade
-3

RAM (words)
256000

Primary Attributes
Kintex?-7 FPGA, 125K Logic Cells

Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB

Length
27mm

Height Seated (Max)
3.24mm

Radiation Hardening
No

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for AMD XC7Z030-3FFG676E.

This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).

Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore? with CoreSight?, this SoC has been developed.The manufacturer assigns this system on a chip with a 676-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq®-7000 series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.For safe operation, it is advisable to utilize a power supply with 1V voltage.In the SoCs wireless, high voltages above 1.05V are considered dangerous and should not be used.The system on a chip uses 676 terminations in total.By searching XC7Z030, you will find system on chips with similar specs and purposes.A wireless SoC that operates at a frequency of 1GHz is what the wireless SoC does.This SoC meaning utilizes a core architecture of ARM as its foundation.In this computer SoC, there are 676 pins.

Dual ARM® Cortex®-A9 MPCore? with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.

XC7Z030-3FFG676E System On Chip (SoC) applications.

Measurement testers
Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness
Healthcare
Medical

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